Modeling of steady and transient temperature distribution in the device for measuring the thermal conductivity

Piotr Duda,

Roman Duda

Abstrakt

The aim of this paper is the presentation of the method for thermal conductivity measurement and numerical modeling of temperature distribution in apparatus for measuring the thermal conductivity. Experimental studies will be carried out in transient state until the steady state heat conduction in apparatus is achieved. The calculated and measured temperature distribution will be compared. The time to steady state in apparatus for different samples will be estimated based on numerical and experimental results. The influence of the contact resistance between the sample and the measuring device will be analyzed.

Słowa kluczowe: heat conduction, CFD modeling
References

Fourier J.B., Théorie analytique de la chaleur, Paris 1822.

Szydłowski H., Pracownia fizyczna, PWN, Warszawa 1999.

Fodemski T., Pomiary cieplne część I podstawowe pomiary cieplne, WNT, Warszawa 2001.

ANSYS® Fluent, 14.0, User manual, ANSYS, Inc.

Patankar S.V., Numerical Heat Transfer and Fluid Flow, Hemisphere Publishing Corporation, 1980.

Taler J., Duda P., Solving Direct and Inverse Heat Conduction Problems, Springer-Verlag, Berlin Heidelberg 2006.

Duda P., Obliczenia cieplne i wytrzymałościowe dla wstawki temperaturowej, Problemy Eksploatacji 79, Nr 4, Kraków 2010, 103-114.

Duda P., Duda R., Modelowanie rozkładu temperatury na stanowisku do pomiaru współczynnika przewodzenia ciepła, Czasopismo Techniczne 2-M/2012, Kraków 2012, 81-88.